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PD-97191B 2N7635M1 IRHLG7670Z4 60V, Combination 2N-2P-CHANNEL RADIATION HARDENED TECHNOLOGY LOGIC LEVEL POWER MOSFET THRU-HOLE (MO-036AB) Product Summary Part Number IRHLG7670Z4 IRHLG7630Z4 Radiation Level 100K Rads (Si) 300K Rads (Si) RDS(on) 0.6 1.25 0.6 1.25 ID 1.07A -0.71A 1.07A -0.71A CHANNEL N P N P MO-036AB International Rectifier's R7TM Logic Level Power MOSFETs provide simple solution to interfacing CMOS and TTL control circuits to power devices in space and other radiation environments. The threshold voltage remains within acceptable operating limits over the full operating temperature and post radiation. This is achieved while maintaining single event gate rupture and single event burnout immunity. These devices are used in applications such as current boost low signal source in PWM, voltage comparator and operational amplifiers. Features: n n n n n n n n n 5V CMOS and TTL Compatible Low RDS(on) Fast Switching Single Event Effect (SEE) Hardened Low Total Gate Charge Simple Drive Requirements Ease of Paralleling Hermetically Sealed Light Weight Absolute Maximum Ratings (Per Die) Parameter ID@ VGS = 4.5V, TC= 25C ID@ VGS = 4.5V, TC=100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current A Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current A Repetitive Avalanche Energy A Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight For footnotes refer to the last page Pre-Irradiation N-Channel 1.07 0.67 4.28 1.0 0.01 10 13 A 1.07 0.1 7.0 A -55 to 150 oC P-Channel -0.71 -0.45 -2.84 1.0 0.01 Units A W W/C 10 21 -0.71 0.1 -14 V mJ A mJ V/ns 300 (0.63 in./1.6 mm from case for 10s) 1.3 (Typical) g www.irf.com 1 04/01/08 IRHLG7670Z4, 2N7635M1 Parameter BVDSS Drain-to-Source Breakdown Voltage BV DSS /T J Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage VGS(th)/TJ Gate Threshold Voltage Coefficient gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current Pre-Irradiation Min 60 -- -- 1.0 -- 0.9 -- -- -- -- -- -- -- -- -- -- -- -- Electrical Characteristics For Each N-Channel Device @Tj = 25C (Unless Otherwise specified) Typ Max Units -- 0.08 -- -- -4.04 -- -- -- -- -- -- -- -- -- -- -- -- 10 -- -- 0.6 2.0 -- -- 1.0 10 100 -100 2.5 0.5 1.6 6.0 2.4 34 11 -- V V/C V mV/C S A nA nC Test Conditions VGS = 0V, ID = 250A Reference to 25C, ID = 1.0mA VGS = 4.5V, ID = 0.67A VDS = VGS, ID = 250A VDS = 10V, IDS = 0.67A A VDS= 48V ,VGS= 0V VDS = 48V, VGS = 0V, TJ =125C VGS = 10V VGS = -10V VGS = 4.5V, ID = 1.07A VDS = 30V VDD = 30V, ID = 1.07A, VGS = 5.0V, RG = 24 A IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance ns nH Measured from Drain lead (6mm /0.25in from pack.) to Source lead (6mm/0.25in from pack.)with Source wire internally bonded from Source pin to Drain pad C iss C oss C rss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance -- -- -- -- 162 39 2.1 13.8 -- -- -- -- pF VGS = 0V, VDS = 25V f = 1.0MHz f = 1.0MHz, open drain Source-Drain Diode Ratings and Characteristics (Per Die) Parameter IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) A Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Min Typ Max Units -- -- -- -- -- -- -- -- -- -- 1.07 4.28 1.2 51 70 Test Conditions A V ns nC Tj = 25C, IS = 1.07A, VGS = 0V A Tj = 25C, IF = 1.07A, di/dt 100A/s VDD 25V A Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. Thermal Resistance (Per Die) Parameter RthJA Junction-to-Ambient Min Typ Max Units -- -- 125 C/W Test Conditions Typical socket mount Note: Corresponding Spice and Saber models are available on International Rectifier Website. For footnotes refer to the last page 2 www.irf.com Pre-Irradiation IRHLG7670Z4, 2N7635M1 Electrical Characteristics For Each P-Channel Device @Tj = 25C (Unless Otherwise specified) Parameter BVDSS Drain-to-Source Breakdown Voltage Min -60 Typ Max Units -- -0.08 -- -- 3.07 -- -- -- -- -- -- -- -- -- -- -- -- 10 -- -- 1.25 V V/C Test Conditions VGS = 0V, ID = -250A Reference to 25C, ID = -1.0mA VGS = -4.5V, ID = -0.45A VDS = VGS, ID = -250A VDS = -10V, IDS = -0.45A A VDS= -48V ,VGS= 0V VDS = -48V, VGS = 0V, TJ =125C VGS = -10V VGS = 10V VGS = -4.5V, ID = -0.71A VDS = -30V VDD = -30V, ID = -0.71A, VGS = -5.0V, RG = 24 A BV DSS /T J Temperature Coefficient of Breakdown -- Voltage RDS(on) Static Drain-to-Source On-State -- Resistance VGS(th) Gate Threshold Voltage -1.0 -- VGS(th)/TJ Gate Threshold Voltage Coefficient gfs Forward Transconductance 0.9 IDSS Zero Gate Voltage Drain Current -- -- IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance -- -- -- -- -- -- -- -- -- -- -2.0 V -- mV/C -- S -1.0 -10 A -100 100 2.8 1.7 0.8 17 20 27 23 -- nA nC ns nH Measured from Drain lead (6mm /0.25in from pack.) to Source lead (6mm/0.25in from pack.)with Source wire internally bonded from Source pin to Drain pad C iss C oss C rss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance -- -- -- -- 138 39 6.7 52.4 -- -- -- -- pF VGS = 0V, VDS = -25V f = 1.0MHz f = 1.0MHz, open drain Source-Drain Diode Ratings and Characteristics (Per Die) Parameter IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) A Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Min Typ Max Units -- -- -- -- -- -- -- -- -- -- -0.71 -2.84 -5.0 30 11 Test Conditions A V ns nC Tj = 25C, IS = -0.71A, VGS = 0V A Tj = 25C, IF = -0.71A, di/dt -100A/s VDD -25V A Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. Thermal Resistance (Per Die) Parameter RthJA Junction-to-Ambient Min Typ Max Units -- -- 125 C/W Test Conditions Typical socket mount Note: Corresponding Spice and Saber models are available on International Rectifier Website. For footnotes refer to the last page www.irf.com 3 IRHLG7670Z4, 2N7635M1 Radiation Characteristics Pre-Irradiation International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-39 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. Table 1. Electrical Characteristics For Each N-Channel Device @Tj = 25C, Post Total Dose Irradiation AA Parameter BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-39) Static Drain-to-Source On-state Resistance (MO-036) Diode Forward Voltage Up to 300K Rads (Si)1 Min 60 1.0 -- -- -- -- -- -- Max Units V nA A V Test Conditions VGS = 0V, ID = 250A VGS = VDS, ID = 250A VGS = 10V VGS = -10V VDS= 48V, VGS= 0V VGS = 4.5V, ID = 0.67A VGS = 4.5V, ID = 0.67A VGS = 0V, ID = 1.07A -- 2.0 100 -100 1.0 0.5 0.6 1.2 1. Part numbers IRHLG7670Z4, IRHLG7630Z4 International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2. Table 2. Typical Single Event Effect Safe Operating Area (Per Die) Ion LET (MeV/(mg/cm )) Br I Au 37 60 84 2 Energy (MeV) 305 370 390 Range (m) 39 34 30 0V 60 60 60 -2V 60 60 60 -4V 60 60 60 -5V 60 60 60 VDS (V) @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= -6V 60 60 - -7V 35 20 - -8V 30 15 - -10V 20 - 70 60 50 40 30 20 10 0 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 VGS Br I Au Fig a. Typical Single Event Effect, Safe Operating Area For footnotes refer to the last page 4 VDS www.irf.com Radiation Characteristics Pre-Irradiation IRHLG7670Z4, 2N7635M1 International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-39 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. Table 1. Electrical Characteristics For Each P-Channel Device @Tj = 25C, Post Total Dose Irradiation AA Parameter BVDSS V GS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-39) Static Drain-to-Source On-state Resistance (MO-036) Diode Forward Voltage Up to 300K Rads (Si)1 Min -60 -1.0 -- -- -- -- -- -- Max Units V nA A V Test Conditions VGS = 0V, ID = -250A VGS = VDS, ID = -250A VGS = -10V VGS = 10V VDS= -48V, VGS= 0V VGS = -4.5V, ID = -0.45A VGS = -4.5V, ID = -0.45A VGS = 0V, ID = -0.71A -- -2.0 -100 100 -1.0 1.20 1.25 -5.0 1. Part numbers IRHLG7670Z4, IRHLG7630Z4 International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2. Table 2. Typical Single Event Effect Safe Operating Area (Per Die) Ion LET (MeV/(mg/cm )) Br I Au 37 60 84 2 Energy Range (MeV) 305 370 390 (m) 39 34 30 0V -60 -60 -60 2V -60 -60 -60 4V -60 -60 -60 5V -60 -60 -60 VDS (V) @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= @VGS= 6V -60 -60 - 7V -50 -20 - 8V -35 - 10V -25 - -70 -60 -50 -40 -30 -20 -10 0 0 1 2 3 4 5 VGS 6 7 8 9 10 Br I Au Fig a. Typical Single Event Effect, Safe Operating Area For footnotes refer to the last page www.irf.com VDS 5 IRHLG7670Z4, 2N7635M1 N-Channel Q1,Q3 10 Pre-Irradiation 10 VGS TOP 10V 5.0V 4.5V 4.0V 3.5V 3.0V 2.75V BOTTOM 2.5V ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) 1 2.5V 1 2.5V VGS 10V 5.0V 4.5V 4.0V 3.5V 3.0V 2.75V BOTTOM 2.5V TOP 60s PULSE WIDTH Tj = 25C 0.1 0.1 1 10 100 VDS, Drain-to-Source Voltage (V) 60s PULSE WIDTH Tj = 150C 0.1 0.1 1 10 100 VDS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 10 2.0 RDS(on) , Drain-to-Source On Resistance ID = 1.07A 1.5 ID, Drain-to-Source Current (A) T J = 150C 1 T J = 25C (Normalized) 1.0 VDS = 25V 20s PULSE WIDTH 0.1 2 2.5 3 3.5 4 VGS, Gate-to-Source Voltage (V) 0.5 VGS = 4.5V 0.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Junction Temperature (C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance Vs. Temperature 6 www.irf.com Pre-Irradiation N-Channel Q1,Q3 RDS(on), Drain-to -Source On Resistance ( ) RDS(on), Drain-to -Source On Resistance () IRHLG7670Z4, 2N7635M1 2.5 ID = 1.07A 2.0 0.8 0.75 0.7 0.65 0.6 0.55 0.5 0.45 0.4 0.35 0.3 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 ID , Drain Current (A) Vgs = 4.5V T J = 25C T J = 150C 1.5 1.0 T J = 150C 0.5 T J = 25C 0 2 3 4 5 6 7 8 9 10 11 12 VGS, Gate -to -Source Voltage (V) Fig 5. Typical On-Resistance Vs Gate Voltage Fig 6. Typical On-Resistance Vs Drain Current V(BR)DSS , Drain-to-Source Breakdown Voltage (V) 80 2.5 VGS(th) Gate threshold Voltage (V) ID = 1.0mA 2.0 70 1.5 1.0 60 ID = 50A ID = 250A 0.5 ID = 1.0mA ID = 150mA 50 -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Temperature ( C ) T J , Temperature ( C ) Fig 7. Typical Drain-to-Source Breakdown Voltage Vs Temperature Fig 8. Typical Threshold Voltage Vs Temperature www.irf.com 7 IRHLG7670Z4, 2N7635M1 N-Channel Q1,Q3 280 240 200 160 120 80 40 0 1 10 100 VGS = 0V, f = 1 MHz C iss = C gs + C gd, C ds SHORTED C oss = C ds + C gd Pre-Irradiation 12 ID = 1.07A VGS, Gate-to-Source Voltage (V) C rss = C gd 10 8 6 4 2 0 0 0.5 1 VDS = 48V VDS = 30V VDS = 12V C, Capacitance (pF) Ciss Coss Crss FOR TEST CIRCUIT SEE FIGURE 17 1.5 2 2.5 3 3.5 4 VDS, Drain-to-Source Voltage (V) QG, Total Gate Charge (nC) Fig 9. Typical Capacitance Vs. Drain-to-Source Voltage 10 Fig 10. Typical Gate Charge Vs. Gate-to-Source Voltage 1.2 1.0 ID, Drain Current (A) ISD, Reverse Drain Current (A) 1 T J = 150C T J = 25C 0.8 0.6 0.4 0.2 0.1 VGS = 0V 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VSD , Source-to-Drain Voltage (V) 0 25 50 75 100 125 150 T C , Case Temperature (C) Fig 11. Typical Source-to-Drain Diode Forward Voltage Fig 12. Maximum Drain Current Vs. Case Temperature 8 www.irf.com Pre-Irradiation N-Channel Q1,Q3 10 32 IRHLG7670Z4, 2N7635M1 EAS , Single Pulse Avalanche Energy (mJ) OPERATION IN THIS AREA LIMITED BY R DS(on) 28 24 20 16 12 8 4 0 ID, Drain-to-Source Current (A) TOP BOTTOM ID 0.48A 0.68A 1.07A 1 1ms Tc = 25C Tj = 150C Single Pulse 1 10 VDS , Drain-to-Source Voltage (V) 10ms 100 0.1 25 50 75 100 125 150 Starting T J , Junction Temperature (C) Fig 13. Maximum Safe Operating Area Fig 14. Maximum Avalanche Energy Vs. Drain Current 1000 Thermal Response ( Z thJA ) 100 D = 0.50 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE ( THERMAL RESPONSE ) P DM t1 t2 10 1 0.1 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.0001 0.001 0.01 0.1 1 10 100 1000 0.01 1E-005 t1 , Rectangular Pulse Duration (sec) Fig 15. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 9 IRHLG7670Z4, 2N7635M1 N-Channel Q1,Q3 Pre-Irradiation V(BR)DSS 15V tp DRIVER VDS L RG VGS 20V . D.U.T IAS tp + V - DD A 0.01 I AS Fig 16b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. Fig 16a. Unclamped Inductive Test Circuit 4.5V QG 12V .2F 50K .3F QGS VG QGD VGS 3mA D.U.T. + V - DS Charge Fig 17a. Basic Gate Charge Waveform VDS VGS RG V GS Pulse Width 1 s Duty Factor 0.1 % IG ID Current Sampling Resistors Fig 17b. Gate Charge Test Circuit VDS 90% RD D.U.T. VDD + - 10% VGS td(on) tr t d(off) tf Fig 18a. Switching Time Test Circuit Fig 18b. Switching Time Waveforms 10 www.irf.com Pre-Irradiation P-Channel Q2,Q4 10 -I D, Drain-to-Source Current (A) -I D, Drain-to-Source Current (A) VGS TOP -10V -5.0V -4.5V -3.0V -2.75V -2.5V -2.25V BOTTOM -2..0V IRHLG7670Z4, 2N7635M1 10 VGS -10V -5.0V -4.5V -3.0V -2.75V -2.5V -2.25V BOTTOM -2..0V TOP 1 1 -2.0V 20s PULSE WIDTH Tj = 150C 0.1 -2.0V 20s PULSE WIDTH Tj = 25C 0.1 0.1 1 10 100 -VDS , Drain-to-Source Voltage (V) 0.1 1 10 100 -VDS , Drain-to-Source Voltage (V) Fig 19. Typical Output Characteristics Fig 20. Typical Output Characteristics 10 2.0 T J = 25C RDS(on) , Drain-to-Source On Resistance ID = -0.71A -I D, Drain-to-Source Current (A) 1.5 T J = 150C 1 (Normalized) 1.0 VDS = -25V 20s PULSE WIDTH 0.1 2 2.5 3 3.5 -V GS, Gate-to-Source Voltage (V) VGS = -4.5V 0.5 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Junction Temperature (C) Fig 21. Typical Transfer Characteristics Fig 22. Normalized On-Resistance Vs. Temperature www.irf.com 11 IRHLG7670Z4, 2N7635M1 P-Channel Q2,Q4 RDS(on), Drain-to -Source On Resistance () Pre-Irradiation 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 2 3 4 5 6 7 8 ID = -0.71A RDS(on), Drain-to -Source On Resistance ( ) 4.0 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0 0.5 1.0 1.5 2.0 2.5 3.0 -I D, Drain Current (A) T J = 25C T J = 150C T J = 150C T J = 25C Vgs = -4.5V 9 10 11 12 -V GS, Gate -to -Source Voltage (V) Fig 23. Typical On-Resistance Vs Gate Voltage -V(BR)DSS , Drain-to-Source Breakdown Voltage (V) Fig 24. Typical On-Resistance Vs Drain Current 75 3.0 -V GS(th) Gate threshold Voltage (V) ID = -1.0mA 70 2.5 2.0 65 1.5 1.0 60 ID = -50A ID = -250A 0.5 ID = -1.0mA ID = -150mA -60 -40 -20 0 20 40 60 80 100 120 140 160 55 -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 T J , Temperature ( C ) T J , Temperature ( C ) Fig 25. Typical Drain-to-Source Breakdown Voltage Vs Temperature Fig 26. Typical Threshold Voltage Vs Temperature 12 www.irf.com Pre-Irradiation P-Channel Q2,Q4 240 VGS = 0V, f = 1 MHz C iss = C gs + Cgd, C ds SHORTED C rss = C gd C oss = C ds + Cgd IRHLG7670Z4, 2N7635M1 12 ID = -0.71A -V GS, Gate-to-Source Voltage (V) 200 10 8 6 4 2 0 0 1 2 VDS= -48V VDS= -30V VDS= -12V C, Capacitance (pF) 160 Ciss 120 80 Coss 40 C rss 0 1 10 100 FOR TEST CIRCUIT SEE FIGURE 35 3 4 5 6 -VDS, Drain-to-Source Voltage (V) QG, Total Gate Charge (nC) Fig 27. Typical Capacitance Vs.Drain-to-Source Voltage Fig 28. Typical Gate Charge Vs. Gate-to-Source Voltage 10 0.8 0.7 -I SD, Reverse Drain Current (A) 1 -I D, Drain Current (A) 3.5 4 T J = 150C 0.6 0.5 0.4 0.3 0.2 0.1 0 T J = 25C 0.1 VGS = 0V 0.01 0 0.5 1 1.5 2 2.5 3 -V SD , Source-to-Drain Voltage (V) 25 50 75 100 125 150 T C , Case Temperature (C) Fig 29. Typical Source-Drain Diode Forward Voltage Fig 30. Maximum Drain Current Vs. Case Temperature www.irf.com 13 IRHLG7670Z4, 2N7635M1 P-Channel Q2,Q4 10 50 Pre-Irradiation EAS , Single Pulse Avalanche Energy (mJ) -I D, Drain-to-Source Current (A) OPERATION IN THIS AREA LIMITED BY R DS(on) TOP 40 BOTTOM 30 ID -0.32A -0.45A -0.71A 1 1ms 0.1 10ms Tc = 25C Tj = 150C Single Pulse 1 10 -VDS , Drain-to-Source Voltage (V) 100 20 10 0.01 0 25 50 75 100 125 150 Starting T J , Junction Temperature (C) Fig 31. Maximum Safe Operating Area Fig 32. Maximum Avalanche Energy Vs. Drain Current 1000 Thermal Response ( Z thJA ) 100 D = 0.50 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE ( THERMAL RESPONSE ) P DM t1 t2 10 1 0.1 Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 0.0001 0.001 0.01 0.1 1 10 100 1000 0.01 1E-005 t1 , Rectangular Pulse Duration (sec) Fig 33. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 14 www.irf.com Pre-Irradiation P-Channel Q2,Q4 VDS L IRHLG7670Z4, 2N7635M1 I AS VDD A RG D.U.T. IAS -20V VGS DRIVER 0.01 tp tp 15V V(BR)DSS Fig 34a. Unclamped Inductive Test Circuit Fig 34b. Unclamped Inductive Waveforms Current Regulator Same Type as D.U.T. -4.5V QG 12V .2F 50K .3F VG VGS -3mA Charge IG ID Current Sampling Resistors Fig 35a. Basic Gate Charge Waveform RD V DS VGS Fig 35b. Gate Charge Test Circuit td(on) tr t d(off) VGS D.U.T. V DD 10% VGS Pulse Width 1 s Duty Factor 0.1 % Fig 36a. Switching Time Test Circuit www.irf.com + - RG 90% VDS Fig 36b. Switching Time Waveforms + D.U.T. - QGS QGD VDS tf 15 IRHLG7670Z4, 2N7635M1 Pre-Irradiation A Total Dose Irradiation with VGS Bias. Footnotes: A Repetitive Rating; Pulse width limited by maximum junction temperature. A VDD = 25V, starting TJ = 25C, L= 22.5mH, Peak IL = 1.07A, VGS = 10V A ISD 1.07A, di/dt 214A/s, VDD 60V, TJ 150C A Pulse width 300 s; Duty Cycle 2% 10 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019, condition A A Total Dose Irradiation with VDS Bias. 48 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, method 1019, condition A VDD = -25V, starting TJ = 25C, L= 85mH, Peak IL = -0.71A, VGS = -10V ISD -0.71A, di/dt -164A/s, VDD -60V, TJ 150C Case Outline and Dimensions -- MO-036AB Q4 Q1 Q3 Q2 Q4 Q1 Q3 Q2 CHANNELS N Ch.- Q1, Q3 P Ch.- Q2, Q4 IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 04/2008 16 www.irf.com |
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